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Solder Flux Paste Soldering Tin Cream Welding Fluxes For PCB/BGA SMD Phone PC

$ 3.66

Availability: 51 in stock
  • Flux Type: General Purpose Flux
  • Custom Bundle: No
  • Condition: New
  • Model: Solder Flux Paste Cream
  • Container Type: Can/Tin
  • Flux Form: Paste
  • Country/Region of Manufacture: China
  • Modified Item: No
  • Brand: custom-sign

    Description

    Specification:
    Model: bst-328
    Size: 37 * 20MM
    Composition: Sn63 / Pb37
    Melting point: 183 °
    Feature:
    Used for the laptop/computer/mobile phone/home appliances SMD IC and BGA IC repairing ,tools for chip-level repairing.
    Is a must product for mobile phones and precision equipment maintenance.
    Weight: approx. 50g
    White and plump solder joint.
    No false welding, strong adhesive with solder iron tip.
    Viscous force lasting, not easy to dry.